![]() Use of a processing disk for processing sapphire glass.
专利摘要:
The invention relates to a use of a machining disk (10), in particular a lapping and / or polishing disk, for machining a sapphire glass. The processing disk (10) comprises a textile backing (11) and a plurality of spaced-apart, on the textile backing (11) arranged processing elements (12) containing at least one metal and at least one resin. The processing elements (12) contain at most 25% by weight, preferably at most 5% by weight, more preferably at most 1% by weight, of abrasive grains, more preferably no abrasive grains. 公开号:CH712250A2 申请号:CH00307/16 申请日:2016-03-09 公开日:2017-09-15 发明作者:Jentgens Christian 申请人:Microdiamant Ag; IPC主号:
专利说明:
Description: The present invention relates to the use of machining disks for machining a sapphire crystal. The machining disks may in particular be lapping and / or polishing wheels. For lapping and polishing various types of processing discs are used. A first grade contains a textile material, but no processing elements or abrasive grains arranged thereon. These include, for example, the processing discs sold by the applicant under the name "QUICK-STEP". Although these processing discs already allow a fairly high material removal. In many applications, such as when working with sapphire glasses, however, even higher material removals are often desirable. A second type of machining discs includes a textile backing having processing elements attached thereto which contain a polymer matrix and abrasive grains embedded therein such as diamond grains. This includes, for example, the product "SQUADRO-M", also distributed by the applicant. However, in some applications, such as when working with sapphire glasses, it is not possible to achieve sufficiently low surface roughness depths. Further processing disks are described, for example, in WO 96/07508 A1, WO 99/08 837 A1, WO 2010/063 647 A1, US Pat. No. 5,022,191, WO 98/42 479 A1 and US Pat. No. 6,837 780 discloses. Also known are machining discs made of copper, which may for example have a spiral groove. For their production, a layer of about 5-10 mm thickness of high-purity, elemental copper is applied to a carrier (for example a steel plate). The copper layer is machined with milling cutters with rotation of the entire disk such that a spiral groove results on the surface of the copper layer. This groove typically has a depth of 1-3 mm, may have a U- or V-shaped configuration, and the grooves are spaced 3-12 mm apart. Although a high removal of material can be achieved with these machining disks; Here too, however, the attainable surface roughness depths are too high for many applications, as they are often required, for example, when working on sapphire glasses. It is therefore an object of the present invention to provide a processing disk and its use for processing sapphire glasses, which allow a most advantageous compromise of high material removal and low Oberflächenrautiefe. In particular, it should be possible to achieve a surface roughness in the nanometer range, if possible by processing with only a single processing disk, so that a more complex CMP ("chemical mechanical polishing") can be dispensed with. This object is achieved by the inventive use of a machining disk for processing a sapphire crystal. The machining disk may in particular be a lapping and / or polishing disk, which is consequently suitable for lapping and / or polishing the sapphire glass. The processing disc includes a textile backing and a plurality of spaced-apart, arranged on the textile base processing elements. These processing elements contain at least one metal and at least one resin. However, according to the invention, the processing elements contain only at most 25% by weight, preferably at most 5% by weight, more preferably at most 1% by weight, of abrasive grains. Particularly preferably, the processing elements contain no abrasive grains at all. As abrasive grains are here and below regarded as such particles which are suitable due to their physical hardness, their preferred sharp-edged shape and in a narrow for the desired processing result band of particle size distribution of the particles for a machining, uniform machining of surfaces. The hardness of the abrasive grains should be at least 15 GPa (Knoop hardness) or at least 2000 HV (Vickers hardness HV30). Due to the small amount of abrasive grains or even the complete absence of abrasive grains in the processing elements can be compared to known processing wheels that contain processing elements with abrasive grains, significantly lower Oberflächenrautiefen reach the machined sapphire glasses. If the machining disk is used together with a suspension containing abrasive grains, nevertheless comparatively high material removals can be achieved. As a result, according to the invention, an advantageous compromise is achieved from high material removal and low surface roughness. The processing elements advantageously contain between 50 wt .-% and 90 wt .-%, preferably between 60 wt .-% and 85 wt .-%, more preferably between 70 wt .-% and 80 wt .-% metal. At lower proportions by weight of the metal result in fact too low material removal. Conversely, with relatively large proportions by weight of the metal, sufficient product strength or product resistance can not be achieved. The metal of the processing elements may include, for example, iron, steel, nickel, chromium, cobalt, copper, tin, antimony, lead, aluminum, bronze, zinc or any combination thereof or consist thereof. The performance-critical property for processing is the hardness of the metals. It is thus possible to select hardnesses in the range of 20-120 HV (Vickers hardness HV30) over the range of the metals mentioned. The hardness of the metal allows a graduated to the size of the additionally used diamond particles penetration depth of these particles in the metal, and consequently a graded processing result on the surface of the workpiece. By a suitable choice of the metal, the values of the material removal and the surface roughness achieved during processing of the sapphire glass can be adjusted. For example, with otherwise identical structures, compositions and machining conditions with copper, smaller surface roughness depths can be achieved than with iron, whereas with iron it is possible to achieve higher material abrasions than with copper. In preferred embodiments, the metal of the processing elements is contained in the form of particles. These particles advantageously have sizes in the range from 10 μm to 200 μm, preferably in the range from 30 μm to 100 μm, particularly preferably in the range from 50 μm to 70 μm. Advantageously, the resin of the processing elements is a UV-cured resin. As a result, a very rapid and targeted hardening can be achieved during the production of the machining disk. In addition, the processing elements can then be made from a solvent-free composition. The resin may contain or consist of a particular aliphatic polyurethane acrylate, an epoxy acrylate or any combination thereof. These resins typically have chemically functional groups such as double bonds or epoxides and, upon addition of suitable initiators, permit intensive curing and thus the achievement of a very high strength of the layer. This strength is necessary so that the layers can be ground flat to the highest requirements with so-called honing stones. The resins are typically selected to allow the use of initiators that allow UV radiation activation. The processing elements may be cylindrical. They are then so limited by a top surface and a lateral surface, wherein the top surface is parallel to the textile base and the lateral surface is formed by a family of mutually parallel sections that extend perpendicular to the textile surface. The top surface may have any shape, in particular the shape of a circle or a polygon, in particular a regular polygon, such as something of an equilateral triangle or a square. In the case of a polygonal top surface, the processing elements are prismatic. The processing elements preferably have a height measured perpendicular to the textile backing in the range of 0.1 mm to 1.0 mm, preferably in the range of 0.2 mm to 0.6 mm, particularly preferably in the range of 0.3 mm up to 0.5 mm. The layer thicknesses mentioned represent an optimal compromise between the covering hardness of the entire structure (including support materials) and the service life or the service life of the machining disk, also with the focus that the machining disk must be ground flat with dressing tools. Furthermore, the processing elements, in particular the cylindrical processing elements, preferably have a diameter in the range of 1 mm to 15 mm, preferably in the range of 2 mm to 8 mm, more preferably in the range of 3 mm to 5 mm. Said diameter is understood as the smallest diameter of an imaginary circular cylinder, which extends perpendicular to the textile base and encloses the processing element. In this form, an optimal flow of cooling lubricants on the machining disk is made possible. The processing elements are spaced from each other, so that channels are formed between them. These allow the controlled removal of a suspension, with which the processing disc can be used together. Preferably adjacent processing elements parallel to the textile substrate have a distance from each other which is in the range of 0.5 mm to 10 mm, preferably in the range of 1.0 mm to 6 mm, particularly preferably in the range of 1 mm to 3 mm. In this form, an optimal flow of cooling lubricants on the machining disk is made possible. As already explained above, the sapphire glass is preferably processed with the processing disk and a suspension, wherein the suspension contains abrasive grains. The suspension is pressed by the processing elements to the surface of the sapphire glass. The abrasive grains contained in the suspension may, for example, be diamonds having sizes in the range from 0.1 μm to 20 μm, preferably in the range from 0.5 μm to 10 μm, particularly preferably in the range from 1 μm to 5 μm can have. The suspension used together with the processing disk preferably contains diamond powder in a concentration (kt / 1) in the range of 0.5 kt / 1 to 200 kt / 1, preferably in the range of 5 kt / 1 to 100 kt / 1, particularly preferably in the range of 10 kt / 1 to 50 kt / 1. The carrier liquids of the diamond suspensions can be specifically adapted and composed of the range of aqueous, glycol-containing or oil-based lubricants and their mixtures and combinations. The machining disk may, for example, be circular and have a diameter which is in the range of 0.1 mm to 20 mm, preferably in the range of 0.5 mm to 15 mm, particularly preferably in the range of 1 mm to 10 mm. On the back, the textile pad may have a pressure-sensitive adhesive layer by means of which it can be attached to a processing machine. The machining disk can be produced, for example, with a screen printing method known per se. Here, a textile backing is first produced or provided. Subsequently, at least one layer of a composition is applied to the textile substrate, this composition containing at least one metal and at least one resin. In a first partial step, a template can be flooded with the composition. For this flooding a squeegee can be used. In a second sub-step, the template can be brought into contact with the textile backing, and the composition can be transferred to the textile backing, which in turn can be done with the aid of a doctor blade. Finally, there is a hardening, for example by UV radiation. It has proved to be advantageous if successively more layers are applied to the textile substrate, wherein a plurality of layers of mutually different compositions are applied. For example, first a first layer of a first composition may be applied to the backing and then cured, wherein the first composition may contain at least one resin but no metal. Subsequently, a second layer of a second composition may be applied and cured on the first layer, wherein the second composition may include at least one metal and at least one resin. Optionally, a third layer may then be applied to the second layer, wherein the third layer may consist of the same composition as the second layer. For example, the first layer may have a thickness in the range of 0.1 mm to 0.5 mm, and the second layer and / or the third layer may have a thickness in the range of 0.1 mm to 0.5 mm. In the following the invention with reference to two embodiments and two comparative examples is shown. For the preparation of processing wheels for an inventive use an aliphatic polyurethane acrylate was used as resins. The reactive diluent used was HDDA, ie 1,6-hexanediol diacrylate. First, a textile pad was provided. These were the same textile backing as in Comparative Example B1 ("QUICK-STEP") described below. The textile underlay "QUICK-STEP" is a PET Mo nano / multifilament fabric with a thickness of 0.5 mm and a hardness of 97 Shore A, which is laminated on a polyurethane membrane film and on the back with a self-adhesive Foil is provided. Thereafter, three layers were successively applied by a screen printing method. In each of the three application steps, a template was flooded with the aid of a first doctor blade with the respective composition. Subsequently, in each of the three application steps, the stencil was brought into contact with the textile base or the layer or layers possibly already present thereon, the doctor being used to transfer the composition with the aid of a second one. Finally, curing in each of the three application steps was carried out by UV radiation. In this way, the processing elements of the inventive processing discs emerged. In the first embodiment A1 according to the invention, the three layers had the following compositions and were applied in the following layer thicknesses: In the second inventive embodiment A2, the three layers had the following compositions and were applied in the following layer thicknesses:
权利要求:
Claims (9) [1] 1. Use of a machining disk (10), in particular a lapping and / or polishing pad, for processing a sapphire glass, wherein the machining disk (10) contains: - a textile pad (11); - a plurality of spaced apart, on the textile substrate (11) arranged processing elements (12) containing at least one metal and at least one resin; wherein the processing elements (12) contain at most 25 wt .-%, preferably at most 5 wt .-%, more preferably at most 1 wt .-% abrasive grains, particularly preferably no abrasive grains. [2] 2. Use according to claim 1, characterized in that the processing elements (12) between 50 wt .-% and 90 wt .-%, preferably between 60 wt .-% and 85 wt .-%, particularly preferably between 70 wt .-% and 80 wt .-% metal. [3] 3. Use according to one of the preceding claims, characterized in that the metal of the processing elements (12) contains iron, steel, nickel, chromium, cobalt, copper, tin, antimony, lead, aluminum, bronze, zinc or any combination thereof or it consists. [4] 4. Use according to one of the preceding claims, characterized in that the metal of the processing elements (12) is contained in the form of particles, the sizes in the range of 10 pm to 200 pm, preferably in the range of 30 pm to 100 pm, particularly preferably ranging from 50 pm to 70 pm. [5] 5. Use according to one of the preceding claims, characterized in that the resin of the processing elements (12) is a UV-cured resin. [6] 6. Use according to one of the preceding claims, characterized in that the resin of the processing elements (12) contains or consists of a particular aliphatic polyurethane acrylate, an epoxy acrylate or any combination thereof. [7] 7. Use according to one of the preceding claims, characterized in that the processing elements (12) are cylindrical, in particular prism-shaped. [8] 8. Use according to one of the preceding claims, characterized in that the sapphire crystal is processed with the processing disk (12) and a suspension, wherein the suspension contains abrasive grains. [9] 9. Use according to claim 8, characterized in that the suspension contains as abrasive grains diamond grains, the sizes in the range of 0.1 pm to 20 pm, preferably in the range of 0.5 pm to 10 pm, more preferably in the range of 1 pm to 5 pm.
类似技术:
公开号 | 公开日 | 专利标题 DE69935084T2|2007-11-15|Rotary dressing roll containing abrasive inserts DE2523501A1|1975-12-11|METHOD OF MANUFACTURING A GRINDING TOOL FOR GRINDING AND POLISHING DE60125200T2|2007-03-29|Ultra-abrasive grit cutter for mirror polishing EP2835220B1|2019-09-11|Trimming tool, and method for manufacturing the same DE10139762A1|2003-02-27|grinding wheel DE102009055428B4|2013-04-11|Roughing and / or cutting disc DE1502642A1|1969-06-04|Diamond forming tool DE102013206613A1|2014-10-16|Method for polishing semiconductor wafers by means of simultaneous two-sided polishing EP1827762B1|2013-09-11|Abrasive product and method for the production thereof DE3142792A1|1982-12-09|GRINDING WHEEL DE4338077C2|1997-04-03|Honing element CH635272A5|1983-03-31|METHOD AND DRESSING TOOL FOR DRESSING A GRINDING WHEEL. DE102009044855A1|2011-06-16|Kit for retrofitting an electrode grinding device and electrode grinding device EP3000558B1|2017-07-12|Tool for processing materials DE102013202509A1|2014-08-21|METHOD AND GRINDING TOOL FOR HIGH-ACCURACY CENTERLESS GRINDING OF HIGH-SURFACE WAVE PARTS CH712250A2|2017-09-15|Use of a processing disk for processing sapphire glass. DE102018110994A1|2019-11-14|Apparatus and method for fine machining toothed and hardened work wheels EP0163843A2|1985-12-11|Tool with a wear protection layer DE3447124C1|1986-01-23|Abrasive tool for fine machining the tooth flanks of hardened gears in particular DE202018104180U1|2018-10-25|Generatively manufactured grinding tool for machining hard materials and composites EP3437761A1|2019-02-06|Method for producing a processingsegment for an abrasive machining tool EP3670050A1|2020-06-24|Processing segment for a machining tool EP3670037A1|2020-06-24|Method for producing a segment for dry processing of materials DE8307880U1|1983-09-15|GRINDING TOOL EP3670038A1|2020-06-24|Method for producing a segment for dry processing of materials
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公开号 | 公开日 CH712250B1|2020-03-31|
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申请号 | 申请日 | 专利标题 CH00307/16A|CH712250B1|2016-03-09|2016-03-09|Use of a processing disc for processing sapphire glass.|CH00307/16A| CH712250B1|2016-03-09|2016-03-09|Use of a processing disc for processing sapphire glass.| 相关专利
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